FLASH DATA SHEET

15131-128G

SanDisk · 128GB MLC · BGA132

SanDisk

Chip Specifications

Structured Data
Brand
SanDisk
Capacity
128GB
Flash Cell
MLC
Process
19nm
Flash Type
NAND
Package
BGA132
Voltage
VCC:3.3V VCCQ:3.3V/1.8V
Operating Mode
Asynchronous mode
Die Count
8
CE Count
4
FLASH ID
453CA5937ED0
453CA5937E50

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 15. Sequential read averages 372.3 MB/s and peaks at 573.0 MB/s; sequential write averages 275.8 MB/s and peaks at 487.0 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM2246EN2R:532.0MB/s, W:430.0MB/sR:21.6MB/s, W:41.3MB/sWindows10紫色U盘板
IS9032R:296.0MB/s, W:190.0MB/sR:0.0MB/s, W:0.0MB/sWindows10-
SM2246XT2R:422.0MB/s, W:358.0MB/sR:13.8MB/s, W:26.9MB/sWindows10U盘板,ASM1153E桥接
SM32802R:400.0MB/s, W:165.0MB/sR:13.2MB/s, W:8.3MB/sWindows10-
SM2246XT2R:416.0MB/s, W:342.0MB/sR:12.0MB/s, W:37.0MB/sWindows10紫色U盘板,1153E桥接最新固件
IS9031R:285.0MB/s, W:111.0MB/sR:0.0MB/s, W:0.0MB/sWindows10-
SM2246EN2R:430.0MB/s, W:415.0MB/sR:21.3MB/s, W:36.2MB/sWindows10ASM1351桥接
SM2246XT2R:419.1MB/s, W:363.1MB/sR:27.1MB/s, W:40.1MB/sWindows10G2板,1153E桥接,CNC外壳
SM2246XT2R:412MB/s, W:375MB/sR:14.1MB/s, W:36.8MB/sWindows10桥接Asm235cm
SM2246EN2R:573MB/s, W:487MB/sR:44.0MB/s, W:53.0MB/sWindows10cnc散热,黑色板,Gen2口测试,asmedia1351桥接,512mb缓存测试
IS9032R:221MB/s, W:181MB/sR:5MB/s, W:0.22MB/sWindows7G2 126版本固件 笔记本原生3.0
SM32801R:387.58MB/s, W:110.91MB/sR:11.68MB/s, W:6.96MB/sWindows10单贴,公版
SM2246EN2R:538.2MB/s, W:456.7MB/sR:27.56MB/s, W:62.92MB/sWindows10-
SM32671R:143MB/s, W:80MB/sR:0MB/s, W:0MB/sWindows10超频19 写保护板可长时间工作
SM32682R:110.27MB/s, W:72.94MB/sR:3.8MB/s, W:0.99MB/sWindows10SM3268M

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official SanDisk datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.