FLASH DATA SHEET

FH64B08UCT1-60

Kingston · 64GB 东芝 TLC · BGA132

Kingston

Chip Specifications

Structured Data
Brand
Kingston
Capacity
64GB
Flash Cell
东芝 TLC
Process
BICS3
Flash Type
NAND
Package
BGA132
Voltage
VCC: 3.3V VCCQ:3.3V/1.8V
Operating Mode
Toggle
Die Count
0
CE Count
2
FLASH ID
983C98B376F2

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 2. Sequential read averages 218.5 MB/s and peaks at 300.0 MB/s; sequential write averages 61.5 MB/s and peaks at 80.0 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM32812R:300MB/s, W:80MB/sR:15MB/s, W:17MB/sWindows103281双贴。共4CE。主控板和金属外壳购于翼浪店铺。加入导热硅胶垫填充,高强度测试温度45℃,全盘不掉速
FC33791R:137MB/s, W:43MB/sR:0MB/s, W:0MB/sWindows10测试架,东芝BICS3、2CE 、TOG

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official Kingston datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.