FLASH DATA SHEET

K9PHGY8S7D

Samsung · 64GB MLC · BGA88/BGA108/BGA316

Samsung

Chip Specifications

Structured Data
Brand
Samsung
Capacity
64GB
Flash Cell
MLC
Process
16nm
Flash Type
NAND
Package
BGA88/BGA108/BGA316
Voltage
VCC: 3.3V VCCQ: 1.8V
Operating Mode
Synchronous mode
Die Count
8
CE Count
8
FLASH ID
ECDE94F3A4C6
Potentially Supported Controllers

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 7. Sequential read averages 371.3 MB/s and peaks at 481.0 MB/s; sequential write averages 275.1 MB/s and peaks at 420.0 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM2246EN2R:481MB/s, W:420MB/sR:27MB/s, W:37MB/sWindows10-
SM32801R:402MB/s, W:220MB/sR:12MB/s, W:12MB/sWindows11加参数
IS9031R:270MB/s, W:260MB/sR:0MB/s, W:0MB/sWindows10可能会掉固件
SM2246XT2R:432.15MB/s, W:277.63MB/sR:15.66MB/s, W:37.84MB/sWindows101153e桥,桥固件141126A1EE82
SM32801R:400.73MB/s, W:238.87MB/sR:18.35MB/s, W:13.78MB/sWindows11ecc12过测拆机颗粒 测速工具asssd 频率参数FE 固件MLC_L06
SM32681R:150MB/s, W:100MB/sR:6.25MB/s, W:1.57MB/sWindows10原生316焊盘,实测数据保持性稳定
SM2259XT22R:462.929MB/s, W:409.099MB/sR:35.537MB/s, W:39.757MB/sWindows11SM2259XT2 ASM235CM USB 3.0下的速度,自行移植后开卡

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official Samsung datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.