FLASH DATA SHEET

NW662

Micron · 64GB MLC · BGA152

Micron

Chip Specifications

Structured Data
Brand
Micron
Capacity
64GB
Flash Cell
MLC
Process
16nm L95B
Flash Type
NAND
Package
BGA152
Voltage
VCC: 3.3V VCCQ: 1.8V
Operating Mode
Synchronous mode
Die Count
4
CE Count
2
FLASH ID
2CA4E554A900

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 21. Sequential read averages 232.5 MB/s and peaks at 420.5 MB/s; sequential write averages 83.6 MB/s and peaks at 312.2 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM32812R:169MB/s, W:62MB/sR:10.0MB/s, W:22.7MB/sWindows10-
SM32672R:110MB/s, W:38MB/sR:0.0MB/s, W:0.0MB/sWindows73267ae写保护板子,板子默认2d跳线,没改。单贴和双贴速度基本一样
IS9032R:270MB/s, W:80MB/sR:0.0MB/s, W:0.0MB/sWindows10-
SM32682R:128.68MB/s, W:39.4MB/sR:0MB/s, W:0MB/sWindows10-
SM32682R:136.99MB/s, W:64.79MB/sR:3.85MB/s, W:3.29MB/sWindows10大文件全盘平均读写,4k1G读写
SM32811R:280.45MB/s, W:37.96MB/sR:10.43MB/s, W:5.84MB/sWindows10-
SM32812R:290.95MB/s, W:70.21MB/sR:8.66MB/s, W:5.69MB/sWindows103281BB主控板
SM32812R:180.21MB/s, W:63.44MB/sR:8.3MB/s, W:5.63MB/sWindows103281AB主控板
SM2246EN2R:357.42MB/s, W:296.79MB/sR:12.77MB/s, W:16.53MB/sWindows10usb3.0
SM2246EN2R:420.51MB/s, W:312.22MB/sR:13.47MB/s, W:26.18MB/sWindows10256南亚缓存1153e桥接,atp封装的nw662
SM32811R:284.46MB/s, W:37.43MB/sR:10.34MB/s, W:6.01MB/sWindows103281N USB type-c 双头 优盘主控板
SM32812R:220.57MB/s, W:63.37MB/sR:11.08MB/s, W:6.06MB/sWindows103281AB
CBM21991R:17.94MB/s, W:10.85MB/sR:0MB/s, W:0MB/sWindows10-
SM2246XT2R:405.9MB/s, W:166.43MB/sR:12.86MB/s, W:27.06MB/sWindows11-
SM32672R:117.97MB/s, W:71.36MB/sR:0MB/s, W:0MB/sWindows103267-AE
SM32802R:391.61MB/s, W:69.65MB/sR:9.81MB/s, W:6.30MB/sWindows11clock:C8
SM2246XT1R:337.45MB/s, W:66.18MB/sR:12.96MB/s, W:26.52MB/sWindows10-
SM32571R:22.03MB/s, W:9.44MB/sR:0MB/s, W:0MB/sWindows103257ENBA
IS9032R:280MB/s, W:82MB/sR:0MB/s, W:0MB/sWindows10-
IS9032R:204.6MB/s, W:78.2MB/sR:0MB/s, W:0MB/sWindows10-
SM32811R:255.97MB/s, W:36.54MB/sR:10.45 MB/s, W:6.29MB/sWindows10SM3281AB

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official Micron datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.