FLASH DATA SHEET

PF29F02T2AOCMG2

Intel · 256GB MLC · BGA132

Intel

Chip Specifications

Structured Data
Brand
Intel
Capacity
256GB
Flash Cell
MLC
Process
L06B
Flash Type
NAND
Package
BGA132
Voltage
VCC:3.3V VCCQ:1.8V/1.2V
Operating Mode
Synchronous mode
Die Count
8
CE Count
8
FLASH ID
89A46432AA01

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 10. Sequential read averages 434.6 MB/s and peaks at 535.7 MB/s; sequential write averages 401.8 MB/s and peaks at 485.6 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM2258XT2R:397.48MB/s, W:359.05MB/sR:14.45MB/s, W:29.81MB/sWindows10用9210B能跑满sata的速度,参考其他人提交的速度,在500上下,但是4k等其他性能要差一点。上面提交的是578的速度,576速度差不多,2258xt发热挺大,注意散热。
SM2258H2R:406MB/s, W:409.2MB/sR:22.0MB/s, W:38.2MB/sWindows10-
SM2258H2R:524.9MB/s, W:480.4MB/sR:14.7MB/s, W:25.3MB/sWindows10USB3.1Gen2 asm235桥接 温度非常烫,极限核心温度101度,表面温度93度(持续跑圈一小时的状态)qq1454621205
SM2258H2R:529.3MB/s, W:480.1MB/sR:23.1MB/s, W:101.2MB/sWindows10接口:直连SATA;工具版本:T0602A,不掉速;跑圈全盘基本70度左右
SM2258H2R:535.67MB/s, W:485.60MB/sR:25.15MB/s, W:49.79MB/sWindows11USSD 235CM GEN2
SM2246EN2R:315.5MB/s, W:278.5MB/sR:15.78MB/s, W:37.24MB/sWindows112246EN+AMS1351
SM2246EN2R:428.19MB/s, W:427.83MB/sR:15.46MB/s, W:37.52MB/sWindows11上次开卡忘了开同步模式所以速度和这次不同
PS31112R:396.8MB/s, W:351.2MB/sR:18.9MB/s, W:31.1MB/sWindows10全盘写160M/s SLC缓存40G
SM2258H2R:531MB/s, W:485MB/sR:21.7MB/s, W:39.2MB/sWindows11-
SM2258XT1R:280.84MB/s, W:260.88MB/sR:15.16MB/s, W:39.92MB/sWindows7-

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official Intel datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.