TH58TFG9DDLBA8C
Toshiba · 64GB MLC · BGA132
Chip Specifications
Structured Data- Brand
- Toshiba
- Capacity
- 64GB
- Flash Cell
- MLC
- Process
- 15nm
- Flash Type
- NAND
- Package
- BGA132
- Voltage
- VCC: 3.3V VCCQ: 3.3V/1.8V
- Operating Mode
- Synchronous mode(Toggle)
- Die Count
- 4
- CE Count
- 4
983A949376D1Flash ID Identification
A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.
Verify in this order:
- Read the ID on the original PCB and record the value returned by every channel and CE.
- Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
- Match the complete ID in the MP tool database, not only the first two bytes.
- Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
- Confirm stability with a limited read/write test before a full-device production run.
Benchmark Records
Associated public benchmark records: 21. Sequential read averages 289.9 MB/s and peaks at 524.0 MB/s; sequential write averages 127.7 MB/s and peaks at 369.3 MB/s.
| Test Controller | Flash Count | Sequential Speed | Random Speed | Operating System | Notes |
|---|---|---|---|---|---|
| SM2246EN | 2 | R:412.0MB/s, W:180.0MB/s | R:17.3MB/s, W:25.8MB/s | Windows10 | U盘主控板 桥接ASM1351，USB3.0 |
| SM2246EN | 4 | R:512.3MB/s, W:369.3MB/s | R:22.6MB/s, W:50.2MB/s | Windows10 | SSD硬盘主控板 |
| SM3281 | 1 | R:254.5MB/s, W:85.2MB/s | R:10.3MB/s, W:6.6MB/s | Windows10 | - |
| SM3280 | 2 | R:384.0MB/s, W:142.0MB/s | R:12.3MB/s, W:7.8MB/s | Windows10 | - |
| IS903 | 2 | R:283.0MB/s, W:198.0MB/s | R:0.0MB/s, W:0.0MB/s | Windows10 | 普通G2绿色板 |
| SM3281 | 1 | R:306MB/s, W:82MB/s | R:12.5MB/s, W:7.7MB/s | Windows10 | - |
| SM3281 | 1 | R:286MB/s, W:78MB/s | R:8.1MB/s, W:6.8MB/s | Windows10 | 3281单帖板子 |
| SM2246EN | 2 | R:524MB/s, W:197MB/s | R:31.1MB/s, W:75.1MB/s | Windows10 | 创见-4帖小板子,SATA 3.0 |
| PS3111 | 2 | R:327.7MB/s, W:184.5MB/s | R:27.2MB/s, W:45.8MB/s | Windows10 | 双头板子，235cm桥接，C头在雷电接口上测速。开卡时未启用slc cache。 |
| SM3267 | 1 | R:138MB/s, W:85MB/s | R:0MB/s, W:0MB/s | Windows10 | - |
| SM3281 | 1 | R:290MB/s, W:81MB/s | R:10MB/s, W:7MB/s | MacOs | 3281AB 双头板type-c&usb |
| IS903 | 2 | R:286.78MB/s, W:195.73MB/s | R:0MB/s, W:0MB/s | Windows11 | - |
| PS3111 | 2 | R:413.57MB/s, W:195.65MB/s | R:22.05MB/s, W:38.51MB/s | Windows11 | AMD 3700X直出3.2Gen2 10Gbps通道，双头PS3111+ASM235CM固态U盘板 |
| IS903 | 1 | R:198MB/s, W:81MB/s | R:0MB/s, W:0MB/s | Windows7 | 测试架 VCCQ=3.3V |
| SM3268 | 1 | R:118MB/s, W:52MB/s | R:0MB/s, W:0MB/s | Windows7 | i5-6200U |
| SM3268 | 1 | R:143MB/s, W:64MB/s | R:0MB/s, W:0MB/s | Windows10 | I5-3450 标压U |
| IS917 | 1 | R:137.6MB/s, W:83.4MB/s | R:0MB/s, W:0MB/s | Windows7 | 主控版本IS917-E1 |
| SM3281 | 1 | R:324.4MB/s, W:74.8MB/s | R:14.1MB/s, W:7.2MB/s | Windows11 | - |
| SM3281 | 1 | R:252.9MB/s, W:74.4MB/s | R:0MB/s, W:0MB/s | Windows11 | - |
| SM3281 | 1 | R:305.6MB/s, W:77.2MB/s | R:10.7MB/s, W:6.9MB/s | Windows11 | 3281AB DBF参数A8改C8超频 |
| IS903 | 1 | R:190.8MB/s, W:102.2MB/s | R:0.0MB/s, W:0.0MB/s | Windows11 | 写保护板 |
Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.
Mass Production and Repair Troubleshooting
Before Mass Production
- Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
- Photograph both sides of the PCB, all chip markings, and jumper states.
- Record the full controller marking, oscillator, Flash count, and CE count per chip.
- Back up the ROM, ISP data, configuration files, and tool logs.
- Use a current-limited power supply to check for shorts and abnormal heating.
When the Device Is Not Detected
- Check VCC/VCCQ, reset, and clock signals.
- Check for weak BGA joints, lifted pads, and broken channel traces.
- Read IDs by channel and CE to isolate a faulty chip.
- Try the matching MP tool version or Flash database.
- Confirm that the firmware supports the process and ECC requirements.
- If uncertainty remains, stop writing and preserve the original state.
Technical Documents and Standards
- Search for the official TH58TFG9DDLBA8C datasheet: prefer the chip vendor’s website and the original PDF, and verify the document revision.
- Official ONFI 6.0 Specification：NAND interfaces, commands, parameter pages, and high-speed timing.
- Official ONFI 5.1 Specification：Covers SDR, NV-DDR, NV-DDR2, NV-DDR3, and related interfaces.
- JEDEC Standards and Document Search：Search standards for packages, electrical characteristics, SSDs, UFS, eMMC, and related technologies.
In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.
Data Reliability Notice
This page is compiled from public structured data and user benchmark records; it is not an official Toshiba datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.