FLASH DATA SHEET

TH58TFT0T23BADE

Toshiba · 128GB TLC · BGA272

Toshiba

Chip Specifications

Structured Data
Brand
Toshiba
Capacity
128GB
Flash Cell
TLC
Process
BiCS3
Flash Type
NAND
Package
BGA272
Voltage
VCC: 3.3V VCCQ: 3.3V/1.8V
Operating Mode
Synchronous mode
Die Count
4
CE Count
4
FLASH ID
983C98B37672
983C98B376F2

Flash ID Identification

A Flash ID is an important identifier, but it cannot prove full compatibility by itself. Vendors may reuse some bytes across capacities, processes, or packages, and MP tools may display the bytes in a different order.

Verify in this order:

  1. Read the ID on the original PCB and record the value returned by every channel and CE.
  2. Compare the part number, capacity, brand, and package to eliminate obvious mismatches.
  3. Match the complete ID in the MP tool database, not only the first two bytes.
  4. Verify geometry parameters such as Page, Block, Plane, LUN, and ECC.
  5. Confirm stability with a limited read/write test before a full-device production run.

Benchmark Records

Associated public benchmark records: 11. Sequential read averages 609.4 MB/s and peaks at 2,682.8 MB/s; sequential write averages 295.4 MB/s and peaks at 1,024.5 MB/s.

Test ControllerFlash CountSequential SpeedRandom SpeedOperating SystemNotes
SM32811R:293.6MB/s, W:75.6MB/sR:13.5MB/s, W:15.2MB/sWindows103281N 272主控板
SM2263XT2R:1234.9MB/s, W:971.5MB/sR:39.4MB/s, W:128.8MB/sWindows102263xt 272双贴板 nvme直插
Other2R:2682.8MB/s, W:1024.5MB/sR:44.9MB/s, W:97.6MB/sWindows10建兴CA3-8D256 马牌88SS1093主控
SM32681R:36.8MB/s, W:32.05MB/sR:4.52MB/s, W:1.03MB/sWindows113268AB 272转152单帖
SM32801R:407.8MB/s, W:97.2MB/sR:14.78MB/s, W:15.54MB/sWindows10BB主控,写入曲线大波浪,CDM结果
SM32681R:104.10MB/s, W:73.65MB/sR:0MB/s, W:0MB/sWindows103268AB 272板子
SM32811R:295.55MB/s, W:78.44MB/sR:11.91MB/s, W:13.87MB/sWindows1181AB 272单贴板,C8
SM32811R:364.55MB/s, W:102.17MB/sR:14.66MB/s, W:15.56MB/sWindows11A8改FA(等效250MHZ),灰烬版,跑圈可过,稳定性待测试
SM32811R:290MB/s, W:82MB/sR:15MB/s, W:15MB/sWindows10-
SM2258H4R:528.93MB/s, W:486.87MB/sR:23.59MB/s, W:58.76MB/sWindows10SM2258H黑色SATA+四贴272转152
SM2259XT22R:464.03MB/s, W:225.87MB/sR:23.36MB/s, W:18.58MB/sWindows7SM2259XT2,未开写入缓存

Speeds apply only to the tested controller, PCB, firmware, interface bridge, capacity, and environment. USB bridges, SLC cache, free-space state, temperature, and benchmark software can materially change the result; these figures are not absolute Flash performance specifications.

Mass Production and Repair Troubleshooting

Before Mass Production

  • Determine whether data recovery is required; mass production and low-level formatting usually destroy the original data.
  • Photograph both sides of the PCB, all chip markings, and jumper states.
  • Record the full controller marking, oscillator, Flash count, and CE count per chip.
  • Back up the ROM, ISP data, configuration files, and tool logs.
  • Use a current-limited power supply to check for shorts and abnormal heating.

When the Device Is Not Detected

  1. Check VCC/VCCQ, reset, and clock signals.
  2. Check for weak BGA joints, lifted pads, and broken channel traces.
  3. Read IDs by channel and CE to isolate a faulty chip.
  4. Try the matching MP tool version or Flash database.
  5. Confirm that the firmware supports the process and ECC requirements.
  6. If uncertainty remains, stop writing and preserve the original state.

Technical Documents and Standards

In the manufacturer datasheet, verify the ordering part number, package code, pins, absolute maximum ratings, operating voltage, interface timing, memory organization, bad-block management, ECC, endurance, and data retention. If search results conflict with this page, rely on the correct datasheet revision and physical measurements.

Data Reliability Notice

This page is compiled from public structured data and user benchmark records; it is not an official Toshiba datasheet. Hardware details can vary by batch, firmware, or tool identification method. Cross-check multiple sources for data recovery, production use, or high-value devices.